The company introduced the MediaTek Dimensity 7300 series of chipsets on Thursday. The Taiwanese semiconductor giant introduced the Dimensity 7300 and Dimensity 7300X chipsets with advanced AI computing capabilities and a focus on multitasking. It is built with TSMC’s advanced third-generation 4nm process technology and offers up to 25 percent lower power consumption compared to the Dimensity 7050 SoC. Notably, the company said that the Dimensity 7300X is designed with foldable foldable smartphones in mind and can support dual displays.
The new chipsets have an octa-core CPU consisting of four Arm Cortex-A78 cores clocked at 2.5 GHz and four Arm Cortex-A55 efficient cores, according to a MediaTek statement. The CPU is paired with an Arm Mali-G615 GPU and MediaTek’s HyperEngine optimization. The company says the combination is aimed at improving the gaming experience on smartphones.
Furthermore, these chipsets are also built with optimizations for resource usage, 5G connectivity and Wi-Fi connections for gaming. Dimensity 7300 chipsets support Bluetooth LE audio technology and Dual-Link True Wireless Stereo (TWS) audio.
In terms of image processing, the chipsets also feature the MediaTek Imagiq 950 ISP, which comes with 12-bit HDR ISP and supports a 200-megapixel primary camera. The hardware engines also have multi-channel noise reduction (MCNR), HWFD (hardware face detection) and video HDR capabilities. The company says these improvements will allow users to capture bright photos and videos in all lighting conditions.
Compared to its predecessor, the Live Focus photo performance feature is up to 1.3X faster, while photo remastering is up to 1.5X faster. The Dimensity 7300 chipsets also allow users to shoot 4K HDR video with more than 50 percent wider dynamic range compared to competitors in the segment, MediaTek claims. This upgrade is said to show more detail in videos.
For AI computing, the chipsets carry the MediaTek APU (Agent Processing Unit) 655 which is claimed to increase the efficiency of AI tasks. The APU can also accept mixed precision data types. This is said to help make better use of memory bandwidth and reduce memory requirements for larger AI models. The company did not highlight the size of the parameter that the APU can handle.
In terms of connectivity, MediaTek Dimensity 7300 chipsets offer between 13-30 percent better energy efficiency in 5G connections below 6 GHz. It supports up to 3.27 Gb per second of 5G downlink via 3CC carrier aggregation. This will allow the chipset to offer faster connections in urban and suburban regions. Furthermore, the chipsets support dual 5G SIM along with dual VoNR (Voice over New Radio) as well as tri-band Wi-Fi 6E.
